study evaluated the influence of Nd:YAG laser on the evaporation degree
(ED) of the solvent components in total-etch and self-etch adhesives.
MATERIALS AND METHODS:
ED of Gluma Comfort Bond (Heraeus-Kulzer) one-step self-etch adhesive,
and Adper Single Bond 2 (3M ESPE), and XP Bond (Dentsply) total-etch
adhesives was determined by weight alterations using two techniques:
Control - spontaneous evaporation of the solvent for 5 min; Experimental
- Nd:YAG laser irradiation for 1 min, followed by spontaneous
evaporation for 4 min. The weight loss due to evaporation of the
volatile components was measured at baseline and after 10 s, 20 s, 30 s,
40 s, 50 s, 60 s, 70 s, 80 s, 90 s, 100 s, 110 s, 2 min, 3 min, 4 min,
and 5 min.
of solvent components significantly increased with Nd:YAG laser
irradiation for all adhesives investigated. Gluma Comfort Bond showed
significantly higher evaporation of solvent components than Adper Single
Bond 2 and XP Bond. All the adhesives lost weight quickly during the
first min of Nd:YAG laser irradiation.
application of Nd:YAG laser on adhesives before light curing had a
significant effect on the evaporation of the solvent components, and the
ED of Gluma Comfort Bond onestep self-etch adhesive was significantly
higher than with Adper Single Bond 2 and XP Bond total-etch adhesives.
use of the Nd:YAG laser on the uncured adhesive technique can promote a
greater ED of solvents, optimizing the longevity of the adhesive