Shirban F, Khoroushi M, Shirban M. A New Solvent-free One-Step Self-Etch
 Adhesive: Bond Strength to Tooth Structures. J Contemp Dent Pract 
2013;14(2):269-274.  
Abstract
Introduction: In recent years some new
 solvent-free dental adhesives have been marketed. This study evaluated 
bonding effectiveness of a new one-step solvent-free self-etch adhesive 
in comparison with a common two-step self-etch adhesive used as gold 
standard. Materials and methods: Flat enamel and dentin surfaces were 
prepared on 60 incisors using silicon carbide papers. Clearfil SE Bond 
(CSEB) and Bond 1SF (B1SF) adhesives were applied on enamel/dentin 
surfaces in four groups (n = 15): (1) Enamel surface and CSEB, (2) 
dentin surface and CSEB, (3) enamel surface and B1SF, (4) dentin surface
 and B1SF. Composite resin buildups were carried out using Z100 
composite resin. All the specimens were stored for 24 hours at 37°C and 
100% relative humidity. After 500 rounds of thermocycling, shear bond 
strength (SBS) test was performed using a universal testing machine at 1
 mm/min crosshead speed. Data were analyzed with one-way ANOVA and a 
post hoc Tukey test (α = 0.05). In each experimental group, two 
additional specimens were prepared for scanning electron microscopy 
evaluation. Results: Significant differences were observed between the 
study groups (p < 0.001). The highest enamel/dentin bond strengths 
were recorded in group 1 (CSEB) (p < 0.001). The SBS of the two-step 
self-etch adhesive to enamel and dentin was significantly higher than 
that of the one-step self-etch adhesive (p < 0.001). There was no 
significant difference between enamel and dentin SBS with B1SF (p = 
0.559). Conclusion: Within the limitations of the present study, when 
bonded to enamel and dentin the solvent-free adhesive B1SF underperforms
 as compared to CSEB as the control gold standard. 
 
Comments